1. The mercury content in compact fluorescent lamps shall not exceed 5 mg/lamp; (2002/95/EC)
Mercury in compact fluorescent lamps not exceeding 5 mg per lamp.
2. The mercury content in general-purpose vertical fluorescent lamps shall not exceed: (2002/95/EC)
- Halophosphate < 10 mg
- Triphosphate with normal lifetime < 5 mg
- Triphosphate with long lifetime < 8 mg
Mercury in straight fluorescent lamps for general purposes not exceeding:
· Halophosphate 10 mg;
· Triphosphate with normal lifetime 5 mg;
Triphosphate with long lifetime 8 mg.
3. Mercury content in vertical fluorescent lamps for special purposes; (2002/95/EC)
Mercury in straight fluorescent lamps for special purposes.
4. Mercury content in other lighting lamps not specifically mentioned in this appendix; (2002/95/EC)
Mercury in other lamps not specifically mentioned in this Annex.
5. Lead content in glass of cathode ray tubes, electronic components and fluorescent tubes; (2002/95/EC)
Lead in glass of cathode ray tubes, electronic components and fluorescent tubes.
6. The lead content in steel alloys should not exceed 0.35%, the lead content in aluminum alloys should not exceed 0.4%, and the lead content in copper alloys should not exceed 4%; (2002/95/EC)
Lead as an alloying element in:
· Steel containing up to 0.35 % lead by weight;
· Aluminium containing up to 0.4 % lead by weight;
· Copper alloy containing up to 4 % lead by weight.
7. -- Lead in high temperature melting solder (e.g. tin-lead solder alloys with a lead content exceeding 85%); (2005/747/EC)
--Network infrastructure equipment for switching, signalling, transmission as well as telecommunications network management for servers, storage and storage array systems
Lead in solders for network management for telecommunications (2005/747/EC)
--Lead in electronic ceramic products (e.g. high voltage electronic devices); (2005/747/EC)
· Lead in high melting temperature type solders (ie lead-based alloys containing 85 % by weight or more lead).
Lead in solders for servers, storage and storage array systems, network
Infrastructure equipment for switching, signaling, transmission as well as network
management for telecommunication.
· Lead in electronic ceramic parts (eg piezoelectronic devices).
8. Unrestricted use of cadmium and cadmium compounds in electrical contacts, and cadmium in cadmium plating other than those prohibited by Directive 91/338/EEC; (2005/747/EC)
Cadmium and its compounds in electrical contacts and cadmium plating except for
applications banned under Directive 91/338/EEC amending Directive 76/769/EEC
relating to restrictions on the marketing and use of certain dangerous substances
and preparations.
9. Hexavalent chromium as a corrosion inhibitor in carbon steel cooling systems in absorption refrigerators. (2002/95/EC)
Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators.
9a. Application of decabromodiphenyl ether in polymers (2005/717/EC)
DecaBDE in polymeric applications.
9b. Lead for lead-bronze bearing shells and bushes; (2005/717/EC)
Lead in lead-bronze bearing shells and bushes.
11. Lead used in compliant pin connector systems; (2005/747/EC)
Lead used in compliant pin connector systems.
12. Lead used in the coating of thermal conduction module c-rings; (2005/747/EC)
Lead as a coating material for the thermal conduction module c-ring.
13. Lead used in optical and filter glass; (2005/747/EC)
Lead and cadmium in optical and filter glass.
14. Lead in composite (containing more than two components) solders containing 80-85% lead used for microprocessor pins and package connections; (2005/747/EC)
Lead in solders consisting of more than two elements for the connection between
the pins and the package of microprocessors with a lead content of more than 80%
and less than 85% by weight.
15. Lead in solder used to form a reliable connection between the semiconductor chip and the carrier in flip chip packaging; (2005/747/EC)
Lead in solders to complete a viable electrical connection between semiconductor
die and carrier within integrated circuit Flip Chip packages.
16. Vertical tungsten filament lamps may contain lead if their tubes contain silicate coatings; (2006/310/EC)
Lead in linear incandescent lamps with silicate coated tubes.
17. Lead halide as a light source and used in HID lamps for professional searchlighting purposes may contain lead; (2006/310/EC)
Lead halide as radiant agent in High Intensity Discharge (HID) lamps used for
professional representation application.
18. If lead is contained in the phosphor as a trigger source (lead content 1wt% or less), and this phosphor is used in discharge tubes of sun tanning lamps containing phosphors such as BSP (BaSi205:Pb), or this phosphor is used in special lamps containing phosphors such as SMS ((Sr,Ba)2MgSi207:Pb), the uses of which include electronic reprinting, lithography, insect trapping lamps, photochemical or medical treatments containing dinitrogen compounds, etc., then lead may be contained; (2006/310/EC)
Lead as activator in the fluorescent powder (1% lead by weight or less) of discharge
lamps when used as sum tanning lamps containing phosphors such as BSP (BaSi2O5:Pb)
as well as when used as speciality lamps for diazo-printing reprography, lithography, insect traps, photochemical and curing processes
containing phosphors such as SMS ((Sr,Ba)2MgSi2O7:Pb).
19. Lead as a specific component of amalgam (i.e. mercury alloy), such as PbBiSn-Hg or PbInSn-Hg, and this amalgam is used as the main amalgam, or if PbSn-Hg is used in auxiliary amalgam, and these amalgams are used in energy-saving lamps (ESL), then they may contain lead; (2006/310/EC)
Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact Energy Saving Lamps (ESL).
20. The glass used to protect the front and rear supports of flat fluorescent lamps in LCDs may contain lead oxide. (2006/310/EC)
Lead oxide in glass used for bonding front and rear substrates of flat fluorescent
Lamps used for Liquid Crystal Displays (LCD).
21. Lead and cadmium in printing inks for use on enamel surfaces of borosilicate glass. (2006/691/EC)
Lead and cadmium in printing inks for the application of enamels on borosilicate
glass.
22. Lead as an impurity in rare earth iron garnet Faraday rotators used in optical fibre communication systems. (2006/691/EC)
Lead as impurity in RIG (rare earth iron garnet) Faraday rotators used for fibre
optical communications systems.
23. Lead in the surface treatment of small pitch parts (connectors with a pitch not exceeding 0.65 mm and a nickel-iron frame, and connectors with a pitch not exceeding 0.65 mm and a copper frame are not within the scope of exemption). (2006/691/EC)
Lead in finishes of fine pitch components other than connectors with a pitch of 0.65
mm or less with NiFe lead frames and lead in finishes of fine pitch components other
than connectors with a pitch of 0.65 mm or less with copper lead-frames.
24. Lead in solders for through hole discoidal and planar multilayer ceramic capacitors. (2006/691/EC)
Lead in solders for the soldering to machined through hole discoidal and planar array
ceramic multilayer capacitors.
25. Lead oxide used in components of plasma display panels (PDP) and surface conduction electron-emitter displays (SED), typical examples include lead oxide in insulating layers before and after glass, lead oxide in total lead electrodes, lead oxide in black stripes (color picture tubes), lead oxide in address electrodes, lead oxide in barrier ribs, lead oxide in sealing glass, lead oxide in encapsulating glass, lead oxide in ring glass, and lead oxide in printing ink. (2006/691/EC)
Lead oxide in plasma display panels (PDP) and surface conduction electron emitter
displays (SED) used in structural elements; notably in the front and rear glass
dielectric layer, the bus electrode, the black stripe, the address electrode, the barrier
ribs, the seal frit and frit ring as well as in print pastes.
26. Lead oxide in glass packaging of blue black lamps (BLB). (2006/691/EC)
Lead oxide in the glass envelope of Black Light Blue (BLB) lamps.
27. Lead alloys used as solder in sensors for high performance loudspeakers (for use in sound systems operating at over 125 dB for extended periods of time). (2006/691/EC)
designated to operate for several hours at acoustic power levels of 125 dB SPL and
above) loudspeakers.
28. Hexavalent chromium in anti-corrosion coatings on metal sheets or metal fasteners used for corrosion protection or electromagnetic interference shielding in certain equipment (IT and telecommunications equipment specified in Category 3 of EU Directive 2002/96/EC). This exemption will end on July 1, 2007. (2006/692/EC)
Hexavalent chromium in corrosion preventive coatings of unpainted metal sheetings
and fasteners used for corrosion protection and Electromagnetic Interference
Shielding in equipment falling under category three of Directive 2002/96EC )
(IT and telecommunications equipment). Exemption granted until 1 July 2007.
29. The limit of lead content in crystal glass is in accordance with Annex I (Categories 1, 2, 3 and 4) of EU Directive 69/493/EEC. (2006/690/EC)
Lead bound in crystal glass as defined in Annex I (Categories 1, 2, 3, and 4) of
Council Directive 69/496/EEC
